1. 2. 3. material content data sheet sales product name ipb80n04s3-03 issued 29. august 2013 ma# MA000366322 package pg-to263-3-2 weight* 1464.07 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 6.365 0.43 0.43 4347 4347 leadframe non noble metal iron 7439-89-6 0.853 0.06 582 inorganic material phosphorus 7723-14-0 0.256 0.02 175 non noble metal copper 7440-50-8 851.691 58.15 58.23 581728 582485 wire non noble metal aluminium 7429-90-5 6.718 0.46 0.46 4589 4589 encapsulation organic material carbon black 1333-86-4 8.768 0.60 5989 plastics epoxy resin - 96.446 6.59 65875 inorganic material silicondioxide 60676-86-0 479.307 32.74 39.93 327379 399243 leadfinish non noble metal tin 7440-31-5 9.657 0.66 0.66 6596 6596 plating non noble metal nickel 7440-02-0 0.228 0.02 156 inorganic material phosphorus 7723-14-0 0.001 0.00 0.02 0 156 solder non noble metal tin 7440-31-5 0.076 0.01 52 noble metal silver 7440-22-4 0.095 0.01 65 non noble metal lead 7439-92-1 3.612 0.25 0.27 2467 2584 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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